Application

• Supports online burn-in screening of XFP, SFP+, QSFP+, QSFP-DD, CFP and other package types (expandable assembly types)
• Supports the stringent requirements of high-speed module product testing

Features

• One board provides a max. current of 12A
• The voltage range can be set to 2~4.5V
• Support voltage and current monitoring function
• Compatible with various packaged modules and communication protocols
• Equipped with two independent burn-in chambers, different parameters can be set for product burn-in tests.
• Maxi. temperature up to 120℃
• Via DDM can track module serial number and record the voltage, temperature, bias current, transmit power and receive power.

Technical specification

Item	Specification
Test Paths[Note 1]	28 pcs x 6 layers x 6 burn-in boards per layer x 2 upper and lower chambers, a total of 2016 modules (SFP package), power consumption of a single module ≤ 1.4W; 12 pcs x 6 layers x 6 burn-in boards per layer x 2 upper and lower chambers, a total of 864 modules (QSFP package), power consumption of a single module ≤ 3.3W; 3 pcs x 6 layers x 6 burn-in boards per layer x 2 upper and lower chambers, a total of 216 modules (QSFP-DD package), power consumption of a single module ≤ 13.2W
Number of Independent Temperature Zones	2
Voltage Output Range	2~4.5V，±1% FS±50mV
Voltage Monitoring	2~4.5V，±1% FS±50mV
Current Limit Range	XFP、SFP+、QSFP+：0~1.2A，±0.5% FS±2mA； QSFP-DD、CFP：0~4A，±0.5% FS±2mA
Current Monitoring	XFP、SFP+、QSFP+：0~1.2A，±0.5% FS±2mA； QSFP-DD、CFP：0~4A，±0.5% FS±2mA
Module Assembly	Support XFP, SFP+, QSFP+, QSFP-DD, CFP and other assembly (Expandable assembly types)
I2C DDM Data Reading	Support 8472 protocol, 8436 protocol, cmis4.0 protocol
Temperature Range	RT+30℃～120℃ (no load)
Temperature Accuracy	±2℃
Temperature uniformity【Air】	Full load ≤±3℃, No load ≤±2℃
Temperature Overshoot	≤3℃
Long-term Temperature Stability	±1℃
Rising time	2℃/min
Power	The total power of a single chamber is ≤1.5KW@50℃; Burn-in chamber power: 10KW during heating, ≤5KW at stable constant temperature; Module working power: Determined by the load module power (With 300mA module current and 2016 modules load, the total power consumption is about 3KW); The total power of the equipment is approximately equal to the power of the burn-in chamber plus the working power of the module

EOS Test

Typical Data

The ambient temperature of the chamber is set to 50°C, and the current of the QSFPDD-SR8 module is about 2.5A,
The module temperature is stable at around 65.3℃, and the temperature fluctuation is less than 0.4℃ over 8 hours.

Under full load, reading the temperature data of the modules evenly distributed in the upper, middle, and lower layers to analyze the temperature uniformity.

Optional Items

Burn-In Chamber

Item	Spec.
#1	Optical Module
#2	COB

Application

• Supports online burn-in screening of XFP, SFP+, QSFP+, QSFP-DD, OSFP, CFP and other package types (expandable assembly types)
• Supports the stringent requirements of high-speed module product testing

Features

• One board provides a max. current of 24A
• The voltage range can be set to 3~4V
• Support voltage and current monitoring function
• Compatible with various packaged modules and communication protocols
• Equipped with two independent burn-in chambers, different parameters can be set for product burn-in tests.
• Maxi. temperature up to 120℃
• The heat dissipation can be dissipated through water circulation, and the burn-in heat balance can be automatically adjusted to make full use of the module's own power consumption and reduce the heat power consumption of the burn-in chambers.
• Via DDM can track module serial number and record the voltage, temperature, bias current, transmit power and receive power.

Technical specification

Item	Specification
Test Paths[Note 1]	28 pcs x 6 layers x 6 burn-in boards per layer x 2 upper and lower chambers, a total of 2016 modules (SFP package), single module current ≤ 0.85A; 12 pcs x 6 layers x 6 burn-in boards per layer x 2 upper and lower chambers, a total of 864 modules (QSFP package), single module current ≤ 1.2A; 6 pcs x 6 layers x 6 burn-in boards per layer x 2 upper and lower chambers, a total of 432 modules (QSFP-DD package), single module current ≤ 4A; 6 pcs x 6 layers x 6 burn-in boards per layer x 2 upper and lower chambers, a total of 432 modules (OSFP package), single module current ≤ 4A [Note] If the actual current of the module exceeds the range, a separate burn-in board can be customized
Number of Independent Temperature Zones	2
Voltage Output Range	3~4V，±1% FS±50mV
Voltage Monitoring	3~4V，±1% FS±50mV
Current Limit Range [Note] Based on the existing burn-in board model	SFP+：0~0.85A，±0.5% FS±2mA； QSFP、QSFP+：0~2A，±0.5% FS±2mA； QSFP-DD、CFP、OSFP：0~4A，±0.5% FS±2mA [Note] If the actual current of the module exceeds the range, a separate burn-in board can be customized
Current Monitoring [Note] Based on the existing burn-in board model	XFP、SFP+、QSFP+：0~1.2A，±0.5% FS±2mA； QSFP、QSFP+：0~2A，±0.5% FS±2mA； QSFP-DD、CFP、OSFP：0~4A，±0.5% FS±2mA [Note] If the actual current of the module exceeds the range, a separate burn-in board can be customized
Module Assembly	Support XFP, SFP+, QSFP+, QSFP-DD, OSFP ,CFP and other assembly (Expandable assembly types)
I2C DDM Data Reading	Support 8472 protocol, 8436 protocol, cmis protocol
Temperature Range	RT+30℃～120℃ (no load)
Temperature Accuracy	±2℃
Temperature uniformity【Air】	Full load ≤±3℃, No load ≤±2℃
Temperature Overshoot	≤3℃
Long-term Temperature Stability	±1℃
Rising time	≥ 2℃/min
Power	The total power of a single-cell module is ≤3KW@60℃; Burn-in chamber power: 10KW during heating, ≤5KW at stable constant temperature; Module working power: Determined by the load module power (With 300mA module current and 2016 modules load, the total power consumption is about 3KW); The total power of the equipment is approximately equal to the power of the burn-in chamber plus the working power of the module
Database	Self-provided SQL database to trace and save module test data
Waterpath Specifications	Water temperature range: 20℃~28℃ Water pressure range: 0.2Mpa~0.3Mpa Flow rate range: not less than 6.5L/min

EOS Test

Typical Data

The ambient temperature of the chamber is set to 50°C, and the current of the QSFPDD-SR8 module is about 2.5A,
The module temperature is stable at around 65.3℃, and the temperature fluctuation is less than 0.4℃ over 8 hours.

Optional Items

Burn-In Chamber

Item	Spec.
#1	Optical Module
#2	COB