PRECISE | Equipment | VCSEL Wafer Tester

100ns Pulse Bar Tester

Edge Emitting Laser Chip Testing and Sorting System

VCSEL Wafer Tester

普賽斯(PREISE) / WT-VL602

VCSEL Wafer Tester

High-power VCSEL Wafer Tester used for wafer testing of vertical cavity surface emission laser wafers, supports testing of LIV, spectrum, near field, and far field related parameters with 100ns pulse width and maximum current of 30A, automatic recognition, fully automatically testing for each chip; supports temperature testing at 25~85°C.
It comes standard with 6-inch wafer testing and is compatible with 2-inch, 4-inch wafer and fragment testing.

  • It supports narrow pulse high current testing(minimum pulse width 100ns, maximum current 30A), dual-probe with kelvin measurement testing, and the probe force is adjustable
  • The LIV test design with an integrating sphere, to collect light and OSA testing.
  • For near field and far field pattern testing, available to apply with different CCD.

Features

  • Compatible with 2-inch, 4-inch, and 6-inch wafer testing.
  • Supports narrow pulse (100ns), maximum current 30A testing.
  • Supports VCSEL wafer testing of horizontal and vertical electrode.
  • TEC Temperature control with range 25~85℃.
  • Supports Kelvin measurement.
  • Supports near field uniformity and bad die testing.
  • Supports far field divergence angle testing.

Technical specification

ItemSpecification
Applicable Wafer Size2 inches、4 inches、6 inches
Chip Current Driving MethodSupport horizontal and vertical electrode.
Pulse Current OutputRange 0~30A,Accuracy 0.5%rdg±250mA,minimum pulse width 100ns
Voltage Measurement RangeRange 0~40V,Accuracy 0.5%rdg±250mV
Power Test RangeUsing integrating sphere to collect light,range 0~200W,Accuracy 0.5% FS±10mW
Wavelength Range400~1100nm;
Other wavelengths can be customized
Output Characteristic Curve(1) LIV characteristic curve
(2) Spectral curve
LIV Test ParametersIth,V,Ir,SE,Rs,P,PCE,Wavelength,FWHM,etc.
Near Field Test ParametersNumber of emitting aperture, dark bad die and consistency;
M2, divergence angle and beam waist testing can be customized.
Far Field Test ParametersDivergence angle (1/e²,D86,D50)、DIP
Spectral Parametersλppeak wavelength
Testing Chuck Temperature Control Range25~85℃,Stability <±1℃

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